DOW CORNING® 340 HEAT SINK COMPOUND
Compound provides thermal coupling of electrical/electronic devices to heat sinks.
NLGI Grade 2, white, used primarily as a non-curing and non-flowing thermally conductive compound.
Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.
Features & Benefits
High thermal conductivity; Low bleed; Stable at high temperatures.
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