DOW CORNING® 340 HEAT SINK COMPOUND

Compound provides thermal coupling of electrical/electronic devices to heat sinks.

Key Properties

NLGI Grade 2, white, used primarily as a non-curing and non-flowing thermally conductive compound.

Applications

Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.

Features & Benefits

High thermal conductivity; Low bleed; Stable at high temperatures.

Product Details

Product Type: Compound
Chemistry: Silicone
Performance Benefit: High Temperature Performance, Thermal Conductivity, Wide Temperature Range
NLGI Grade: 2
Thickener: Zinc Oxide
High Temp: 199°C
Low Temp: -40°C
Color: White

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